PLATING METHOD OF PRINTED WIRING BOARD

PURPOSE:To lessen a masking tape in usage and to decrease processes in number by a method wherein printed wiring boards are plated as held keeping their rear sides bearing against each other. CONSTITUTION:When the exposed sides of two printed wiring boards as held keeping their rear sides bearing ag...

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Bibliographische Detailangaben
Hauptverfasser:	ONO YASUNORI, MAEDA SOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To lessen a masking tape in usage and to decrease processes in number by a method wherein printed wiring boards are plated as held keeping their rear sides bearing against each other. CONSTITUTION:When the exposed sides of two printed wiring boards as held keeping their rear sides bearing against each other are masked with a masking tape 2 and the part of the wiring boards 1 other than the masked part is plated, this method can be lessened in usage of masking tape as compared with a method in which two printed boards are separately masked and plated, and a masking tape stripping operation can be lessened in man-hour, and processes can be decreased in number.