ADHESIVE TAPE FOR SEMICONDUCTOR PACKAGE

PURPOSE:To improve the reliability of a package by adding diamond powder, as a filler, to the heat-resistant adhesive coating of an adhesive tape for the semiconductor package to improve its heat radiation. CONSTITUTION:An adhesive tape for a semiconductor package is composed of a heat-resistant fil...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHIBUYA AKIHIRO, SAKUMOTO YUKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To improve the reliability of a package by adding diamond powder, as a filler, to the heat-resistant adhesive coating of an adhesive tape for the semiconductor package to improve its heat radiation. CONSTITUTION:An adhesive tape for a semiconductor package is composed of a heat-resistant film that is coated with heat-resistant adhesive on one or both sides. The adhesive coating, 1-150mum thick, contains diamond powder with a grain size less than 1mum as a filler, so that it has a heat conductivity greater than 10W/cm-k for improved heat radiation. When the semiconductor package is sealed with high-temperature resin, therefore, heat is dissipated and reliability is maintained.