MANUFACTURE OF COMPOSITE PRINTED CIRCUIT BOARD

PURPOSE:To enhance electric connection reliability of a through hole by thermally press-bonding a plurality of through hole printed circuit boards through an adhesive layer in such a manner that the holes are opposed, and solder leveling. CONSTITUTION:A heat curable adhesive 6 is mounted on an RPC(rigid printed circuit board), an FPC(flexible printed circuit board) is so mounted thereon that through holes 1a, 4a are opposed, and the FPC and the RPC are thermally press-bonded through the layer of the adhesive 6 to be integrated. Then, in a solder leveling process, the integrated board is dipped in solder 8, hot air 9 is blown to it while lifting it, thereby obtaining a composite printed circuit board in which the FPC and the RPC are connected. The solder introduced into the gap 7 between the through hole connected parts remains filled, thereby electrically completely connecting them.