PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION LAMINATE FORMED BY USING THIS COMPOSITION
PURPOSE:To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. CONSTITUTION:The...
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| creator | NAKASAKI HIDEO ICHIKAWA TATSUYA |
| description | PURPOSE:To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. CONSTITUTION:The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. This photosensitive resin compsn. exhibits an excellent adhesive property to metallic laminates and particularly copper-lined laminates used for printed wiring boards and has the excellent etching property of the underlying metal and etching resistance as well as the excellent characteristics to obviate the generation of plating pits. |
| format | Patent |
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CONSTITUTION:The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. This photosensitive resin compsn. exhibits an excellent adhesive property to metallic laminates and particularly copper-lined laminates used for printed wiring boards and has the excellent etching property of the underlying metal and etching resistance as well as the excellent characteristics to obviate the generation of plating pits.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911025&DB=EPODOC&CC=JP&NR=H03240063A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911025&DB=EPODOC&CC=JP&NR=H03240063A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKASAKI HIDEO</creatorcontrib><creatorcontrib>ICHIKAWA TATSUYA</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION LAMINATE FORMED BY USING THIS COMPOSITION</title><description>PURPOSE:To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. CONSTITUTION:The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. 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CONSTITUTION:The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. This photosensitive resin compsn. exhibits an excellent adhesive property to metallic laminates and particularly copper-lined laminates used for printed wiring boards and has the excellent etching property of the underlying metal and etching resistance as well as the excellent characteristics to obviate the generation of plating pits.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS |
| title | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION LAMINATE FORMED BY USING THIS COMPOSITION |
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