PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION LAMINATE FORMED BY USING THIS COMPOSITION

PURPOSE:To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. CONSTITUTION:The...

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Bibliographische Detailangaben
Hauptverfasser:	NAKASAKI HIDEO, ICHIKAWA TATSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. CONSTITUTION:The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. This photosensitive resin compsn. exhibits an excellent adhesive property to metallic laminates and particularly copper-lined laminates used for printed wiring boards and has the excellent etching property of the underlying metal and etching resistance as well as the excellent characteristics to obviate the generation of plating pits.