INSPECTING DEVICE FOR SOLDER PASTE APPLIED STATE

PURPOSE:To decide the quality of an applied state of solder paste by executing an image pickup of a reflected light patter of a spot light irradiating a printed board by a laser beam and an optical system, and comparing a shape of the pattern subjected to image pickup with a reference value. CONSTIT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAKIMORI NOBUAKI, MATSUOKA TAKAO, HARADA TOSHITA, NAITO TAKESHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To decide the quality of an applied state of solder paste by executing an image pickup of a reflected light patter of a spot light irradiating a printed board by a laser beam and an optical system, and comparing a shape of the pattern subjected to image pickup with a reference value. CONSTITUTION:A beam radiated from a semiconductor laser 3 passes through a diffraction grating 4 and a beam splitter 5, and thereafter, is condensed by a collimator lens 6 and an objective lens 7, and forms a spot beam 18 for forming a focus on the surface of a printed board 2. The beam 18 reflected by the substrate 2 passes through the lenses 7, 6 on the contrary to the time of incidence, and thereafter, is reflected by the splitter 5, adjusted as to its focal distance by a concave lens 8 and a cylindrical lens 9 and led to a photoelecric converting part of an image pickup part (CCD camera) 10. An output signal from the image pickup part 10 is subjected to A/D conversion 11, led to a detecting circuit part 12, and used as a recognizing signal of an applied state of solder paste 1 on the substrate 2. In the circuit part 12, this signal is compared with a reference value to which the applied state of the paste 1 is set, and its quality is decided.