MANUFACTURE OF LEAD FRAME

PURPOSE:To plate a bonding part in a uniform thickness and to prevent irregularities in the depressed depth by a method wherein, after a difference in level has been formed, the residual part of an inner lead part excluding an inner end part and both faces of an island part are shielded respectively...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KONDOU HIROFUMI, FUJIWARA MEGUMI, ISHIDA NOBUMASA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To plate a bonding part in a uniform thickness and to prevent irregularities in the depressed depth by a method wherein, after a difference in level has been formed, the residual part of an inner lead part excluding an inner end part and both faces of an island part are shielded respectively and sandwiched and the inner end part of the inner lead part is plated selectively. CONSTITUTION:A support stand is provided with the following: a lead mounting part 4 surrounding an opening part 40; an island mounting part 5 formed at the central part of the opening part 40. The lead mounting part 4 is lowered by the portion of the difference in level of a lead frame 1 from the island mounting part 5. Both mounting faces 4a, 5a are extended horizontally; an inner lead part 1a and an island part 1b are mounted via mask sealing materials 2, 3. After the difference in level has been formed, the inner lead part 1a excluding an inner end part and both faces of the island part 1b are shielded and sandwiched; the inner end part of the inner lead part 1a is plated selectively. Thereby, a bonding part can be plated easily in a uniform thickness; it is possible to prevent an irregularity in a depressed depth; a process can be simplified.