TREATMENT OF MATERIAL TO BE TREATED AND TREATING DEVICE

PURPOSE:To shorten the whole time spent in treatment and to drastically enhance throughput by supplying the same reactive gas to both a standby chamber and a reaction chamber before a shielding means is opened and a material to be treated is sent to the reaction chamber from the standby chamber and closing the shielding means and thereafter treating the material to be treated by the reactive gas in the reaction chamber. CONSTITUTION:The materials 3b to be treated are set in a standby chamber 2 and thereafter the inside of the chamber 2 is exhausted 8. The same reactive gas is introduced 5, 6 into the reaction chamber 1 and the chamber 2. The flow rate regulation of the reactive gas and the pressure regulation of the chambers 1, 2 are performed. Then a shielding means 4 is opened to transfer one of the materials 3b to be treated to the chamber 1 and thereafter closed. Reaction of the reactive gas is started by a reaction controlling means 1a and treatment such as formation and etching, etc., of deposit is performed for the material 3a to be treated. Then the means 4 is opened to return the treated material 3a to the chamber 2 and also the untreated material 3b is transferred to the chamber 1 and the means 4 is closed. Then the above-mentioned respective stages are repeatedly performed for the whole material to be treated.