HEAT SINK STRUCTURE FOR ELECTRONIC DEVICE

PURPOSE:To improve heat dissipation, to prevent the interior of a housing from dew-condensing and to reduce in size by providing an integral heat sink members oppositely to the interior and exterior of the housing in close contact with a unit to be necessarily heat dissipated, and providing a cavity...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TETSU SADAYUKI, TAKEHARA TOMOYUKI, MIYAMOTO MANABU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To improve heat dissipation, to prevent the interior of a housing from dew-condensing and to reduce in size by providing an integral heat sink members oppositely to the interior and exterior of the housing in close contact with a unit to be necessarily heat dissipated, and providing a cavity communicating with the interior of the housing near the close contact part. CONSTITUTION:A communication unit 62 is secured in close contact with a flat plate 54 opposed to the interior of a heat sink member of a housing, and a fin 56 formed integrally with the plate 54 is exposed with the exterior of the housing. A cavity 60 is formed in shape to be passed to the plate 54, and moisture in the housing is condensed in the cavity 60.