MULTILAYER FILM CAPACITOR

PURPOSE:To sharply reduce the amount of material and manhours by forming an outer electrode by thermal spraying copper by decompressed plasma spraying method. CONSTITUTION:Three layers of inner electrode layers 2 and two layers of dielectric layers 3 are stacked alternately on one side of an insulating board 1. These inner electrode layers 2 are respectively arranged, being dislocated in both directions of the insulating board from layer to layer to the dielectric layers 3, and adjacent inner electrode layers 2 are opposed to each other across a dielectric layer 3. And a film laminate part A is constituted of the laminate part by the electrode layers 2 and the dielectric layers 3 excluding the ends of the extensions of the electrode layers 2, a protective film 4 is formed to cover the outside of the laminate part A and the board in the vicinity extensively. Furthermore, outer electrodes 5 are made at both ends of the board 1 including the ends of the extensions of the electrode layers 2 not covered with the protective layer 4 by thermal spraying copper respectively by decompressed plasma spraying method.