METHOD AND DEVICE FOR LOADING WAFER

PURPOSE:To increase the number of the wafers to be transported in certain time duration by constituting a transporting body system which positions the respective wafers at all times to the respective sections of 1st to 3rd sections and nearly simultaneously transfers the respective wafers to the ens...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHIWATARI TOMOHIRO, YAMAKOSHI KENJI, TSUBURA YOSHIAKI, NAITOU TAKAMASA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To increase the number of the wafers to be transported in certain time duration by constituting a transporting body system which positions the respective wafers at all times to the respective sections of 1st to 3rd sections and nearly simultaneously transfers the respective wafers to the ensuing sections. CONSTITUTION:The wafers successively transported from wafer cassettes 5a to 5d are first set in home positions. The section where the central axes thereof are aligned and the section where the orientation flat of the wafers are aligned are separated and independently set respectively as the 1st section 10 and the 2nd section 12. In addition, the device is so constituted that the central axis alignment in the 1st section 10 and the orientation flat alignment in the 2nd section 12 are nearly simultaneously executed and the transportion of the wafers is the 1st section 10 where the wafers are subjected to the central axis alignment to the 2nd section 12 and that of the wafers in the 2nd section 12 where the orientation flat of the wafers are aligned to the 3rd section 13 is executed nearly simultaneously.