SEMICONDUCTOR MANUFACTURING DEVICE

PURPOSE:To prevent a semiconductor element and a circuit board from being damaged due to the warpage of a bonding tool and a load at the time of a bonding by a method wherein the leads of a film carrier tape are pressed to parts to be bonded by a wind pressure. CONSTITUTION:Inner leads 3a of a film carrier tape 3 are respectively bonded on bump electrodes 2. In this case, gas 21 flows in a nozzle 20 and a wind pressure 22 is applied on the inner lead through the point of the nozzle. The inner lead is heated by the energy of a laser 23 and the bonding of the inner leads to the electrode 2 is contrived. Or, as an even forming is not formed at the time of a lead forming or the like of outer leads 3c, irregularities in the height of the leads 3c at bonding parts are generated, the leads push down the gaps, which are formed between the leads and lands 9, by the wind pressure 22 of the gas 21, the leads are brought into such a state that they are brought into contact closely to the lands 9 and the laser 23 or the like is irradiated to conduct the bonding.