WIRING-PATTERN INTERSECTING METHOD FOR PRINTED BOARD

PURPOSE:To decrease the number of layers in a printed board and to decrease the number of via holes by inserting a connecting member into a connecting hole in the printed board, electrically bonding connecting conductors and lands, and making it possible to intersect wirings on the same layer. CONST...

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1. Verfasser: MINAGAWA EIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To decrease the number of layers in a printed board and to decrease the number of via holes by inserting a connecting member into a connecting hole in the printed board, electrically bonding connecting conductors and lands, and making it possible to intersect wirings on the same layer. CONSTITUTION:A connecting member 15 wherein a plurality of connecting conductors 15-2 are embedded in an insulating body 15-1 is inserted into a connecting hole 13 provided at the intersecting point of wiring patterns 12-1 and 12-2 which are expected to be crossed. The end parts of the connecting conductors 15-2 are electrically bonded to lands 14 which are conducted to the wiring patterns 12-1 and 12-2. At this time, the wiring patterns 12-1 and 12-2 which are broken at the connecting hole 13 are connected without short circuits. Therefore, the patterns are crossed on the same layer. Thus via hole and inner-layer patterns for intersection for crossing the wirings are not required. In this way, the number of the layers in a substrate 11 can be decreased, the number of the via holes can be decreased and the cost of manufacturing can be decreased to a large extent.