METHOD AND DEVICE FOR INSPECTING AND CORRECTING ORIGINAL PATTERN PLATE
PURPOSE:To allow the correction of the defect positions of an original plate to be detected by collation without errors when the positions are detected by forming punch holes positioned to the coordinates of a defect on a mask film to be superposed on the pattern original plate to be inspected and r...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To allow the correction of the defect positions of an original plate to be detected by collation without errors when the positions are detected by forming punch holes positioned to the coordinates of a defect on a mask film to be superposed on the pattern original plate to be inspected and registering and superposing this mask film on the pattern original plate to be inspected. CONSTITUTION:The etching original plate 11 is subjected to the inspection of the presence or absence of defects of the patterns 12 thereof. The master film 15 is bored with the punch holes 16 in the defect coordinate positions in accordance with the detection data of the above-mentioned defect coordinates without expanding or contracting the coordinate systems and is bored with registration holes 17 in correspondence to the position reference marks 13 of the original plate 11. The only the defect parts of the patterns 12 on the original plate 11 are, therefore, exposed by the punch holes 16 when the film 15 is superposed on the original plate 11 and the position reference marks 13 and the registration holes 17 are registered. The conduction of a touch operation is, therefore, possible through the punch holes 16. The easy and sure correction of the defect parts without requiring the special collation operation is possible in this way. |
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