PLATING METHOD FOR RARE EARTH-BARIUM-COPPER ALLOY

PURPOSE:To easily plate rare earth-barium-copper alloy into a uniform film shape by dissolving rare earth, barium and copper as halides into a solvent mixed with dimethyl sulfoxide and pyridine and electrolyzing this soln. CONSTITUTION:The respective halides of rare earth, Ba and Cu are dissolved at the prescribed amount into a solvent mixed with dimethyl sulfoxide and pyridine. Further, the amount of pyridine in the solvent is regulated to a degree wherein precipitate is not formed. Then electrolysis is performed while utilizing the obtained soln. as an electrolyte. Therein a plated layer contg. rare earth, Ba and Cu is formed on a cathode. Thereby rare earth-Ba-Cu alloy plating which is capable of becoming a precursor for obtaining the film of oxide high- temp. superconductive substance RBa2Cu3O7-delta (R shows rare earth) is easily obtained as a uniform film shape at high formation velocity without necessitating an expensive device.