LEAD FRAME

PURPOSE:To enable sure correspondence even if the number of bonding pads increases by providing a frame-shaped conductive plate, which is arranged inside the space surrounded by the tops of inner leads, with an independent electrode and a frame- shaped common electrode, and using the frame-shaped common electrode as an electrode for power source or an electrode for earth. CONSTITUTION:A plane 3 for mounting semiconductor elements and an insulator film 5 for independent electrode are integrally stuck to the power source plane 4 being a frame-shaped electrode plate, and in the power source plane 4, a frame-shaped electrode for power source is made, and in the plane 3 for mounting semiconductor elements and the insulator film 5 for independent electrode, frame-shaped electrodes for earth are made, respectively. Accordingly, for the connection of the power source, the wire can be bonded respectively from the optional electrode on the semiconductor element to the optional place of the electrode for the frame-shaped power source on the power source plane 4. Moreover, for the connection of earth, the wire can similarly by bonded from the optional electrode on the semiconductor element to the optional places of the frame-shaped electrode for earth on the plane 3 for mounting semiconductor element and the frame-shaped electrode for earth on the insulator film 5 for independent electrode, thus it can cope with multipin promotion.