ELECTRICALLY CONDUCTIVE PASTE

PURPOSE:To obtain electrically conductive paste capable of preventing the lowering of bonding strength due to holding at a high temp. and not deteriorating solder wettability by dispersing a solid compsn. consisting of Cu powder and glass frit contg. CuO in an org. vehicle. CONSTITUTION:A solid comp...

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Bibliographische Detailangaben
Hauptverfasser:	HAMADA KUNIHIKO, KASATSUGU TORU, TANI KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GLASS INKS INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain electrically conductive paste capable of preventing the lowering of bonding strength due to holding at a high temp. and not deteriorating solder wettability by dispersing a solid compsn. consisting of Cu powder and glass frit contg. CuO in an org. vehicle. CONSTITUTION:A solid compsn. consisting of Cu powder whose particle size is preferably 0.3-1.5mum and glass frit contg. CuO is dispersed in an org. vehicle, e.g. prepd. by dissolving ethylcellulose in alpha-terpineol to obtain desired electrically conductive paste. The glass frit may be conventional PbO-B2O3 or PbO-SiO2-B2O3 glass frit and is preferably glass frit sinterable within the temp. range of 550-700 deg.C. The solid compsn. in the electrically conductive paste preferably contains 90-98wt.% Cu powder.