CERAMIC CIRCUIT BOARD AND MANUFACTURE THEREOF

PURPOSE:To improve adhesive strength by forming a coating of Ni-B on the surface of a roughed ceramic board, further forming Cu coating on the upper surface, and forming conductor wirings except the necessary part of the Ni-B and Cu coatings. CONSTITUTION:An alumina ceramic board is cleaned with deg...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKISHIMA TETSUYA, WATABIKI TSUTOMU, IKEDA MASAYOSHI, YOKOYAMA RITSUO, HIROYAMA YUKIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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