CERAMIC CIRCUIT BOARD AND MANUFACTURE THEREOF

PURPOSE:To improve adhesive strength by forming a coating of Ni-B on the surface of a roughed ceramic board, further forming Cu coating on the upper surface, and forming conductor wirings except the necessary part of the Ni-B and Cu coatings. CONSTITUTION:An alumina ceramic board is cleaned with degreasing solution, dried, then dipped in heated solution saline mixture to uniformly roughen the board. Them, the board 1 is formed with an Ni-B film 2. Thereafter, a Cu film 3 is formed on the film 2 by electric Cu plating. After plating, photoresist film is adhered on the entire film 3, a negative film formed with a transparent part of the same shape as an obtained conductor circuit, and the film arranged on the lower surface of the exposed negative film is cured. Then, the film cured with NaOH solution is peeled, cleaned with pure water, then dried to form conductor wirings 4.