SUCTION/HOLDING DEVICE

PURPOSE:To enable a collet to surely suck a semiconductor die without going a shock to it by a method wherein a damper which is formed of soft and elastic material and provided with many fine holes is provided to the surface of the collect which sucks the plate-like semiconductor die. CONSTITUTION:A suction head 1 sucks a die 4 separated from a wafer 3 fixed to an adhesive tape 2, moves to a prescribed position, and places the die 4 at the position concerned stopping sucking. The suction head 1 is composed of a collet 5, a porous tape 6, an exhaust pipe 7, reels 8 and 8' and reel drives 9 and 9'. The collet 5 is formed into the shape of tube whose outer and inner diameter are 0.5mm and 0.1mm respectively, and the die 4 of a 1mm square is sucked by one end of the collet 5 through the intermediary of the porous tape 6. The other end of the collet 5 is connected to a vacuum pump through the intermediary of the exhaust pipe 7 and a valve. By controlling the valve concerned, the surface of the porous tape 6 is made to suck the die 4 or not.