SEMICONDUCTOR PACKAGE AND MANUFACTURE THEREOF

PURPOSE:To keep unchanged pin tensile strength and pin bending strength, eliminate the need of a plating lead wire, and save intermediate Ni plating by forming a metal layer with application and baking of organic metal phase including at least one kind of organic Pt compounds and organic Ph compounds, etc. CONSTITUTION:A surface conductor 2 and an internal conductor 4 are formed on one principal surface of a ceramic substrate 1, and a condenser is exposed onto the other principal surface to form a pin junction part conductor. An exposed surface of the conductor 4 is coated with a metal layer 5 formed with organic metal paste, to the surface of which a pin 7 is connected with silver wax 6. The metal layer 5 is formed by application and baking of organic metal paste including at least one kind of organic Pt compounds, organic Ni compounds, organic Co compounds, organic Cu compounds, organic Rt compounds, etc., and is located in the middle between the conductor 4 and the silver wax 6 for disposing vertically the pin 7. Thus, the metal layer 5 makes strong contact with the conductor 4 and keep wetness with the silver wax 6, and hence is allowed to join with the conductor and the pin 7 with high strength. Hereby, pin tensile strength and pin bending strength can be kept un changed, and use of a dammy part and a plating lead wire is eliminated, and further intermediate Ni plating can be saved.