SUSCEPTOR

PURPOSE:To suppress the generation of pinholes by freely attachably and detachably providing a spot facing member provided with a spot facing part to be imposed with a wafer on the surface of a susceptor body. CONSTITUTION:SiC coating 3 having 50 to 200mum thickness is formed on the surface of the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAZOE HARUO, MATSUDA SHOJI, KATO SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CRYSTAL GROWTH ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:	PURPOSE:To suppress the generation of pinholes by freely attachably and detachably providing a spot facing member provided with a spot facing part to be imposed with a wafer on the surface of a susceptor body. CONSTITUTION:SiC coating 3 having 50 to 200mum thickness is formed on the surface of the susceptor body 1 constituted of a carbon base material. The spot facing member 4 is freely attachably and detachably mounted to the susceptor body 1. The spot facing member 4 and the recessed part 2 of the susceptor body 1 are formed to the completely corresponding shape and there are no spacings at all between both. The spot facing member 4 constituted of only the SiC is formed to the tray shape of approximately the same thickness over the entire part. The spot facing member 4 is removed from the susceptor body 1 and is subjected to an etching treatment at the time of etching and therefore, the spot facing member 4 is not etched. The generation of the pinholes is consequently averted. The spot facing member 4 is made of single material and, therefore, the pinholes are not generated in the spot facing part 6 even if the spot facing member 4 is held mounted in the susceptor 1 and is subjected to the etching treatment in this state.