STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER
PURPOSE:To make it possible to cool efficiently ICs mounted on printed boards by a method wherein hinges are respectively provided between the printed boards arranged centering around a tube, cooling plates, which are respectively mounted with a flow path tube, are held by the hinges and a fluid hav...
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| creator | SUZUKI SHINYA HIROSE SEIICHI |
| description | PURPOSE:To make it possible to cool efficiently ICs mounted on printed boards by a method wherein hinges are respectively provided between the printed boards arranged centering around a tube, cooling plates, which are respectively mounted with a flow path tube, are held by the hinges and a fluid having a large specific heat is made to flow through the interiors of the flow path tubes. CONSTITUTION:An IC tester is constituted of a tube 11 arranged at the central part of the IC tester and a plurality of printed boards 13, which are arranged radially on the periphery of the tube 11 and are respectively mounted with ICs 12, and a test head for the IC tester use is provided with hinges 1, which are respectively fixed between the boards 13, a pair of cooling plates 3, which are held one side of them by each hinge 1 and are respectively mounted with a flow path tube 2, and heat conducting plates 5 which are respectively formed of a plurality of elastic projecting parts 4. The plates 5 are respectively inserted between a pair of the plates 3 and the ICs 12, the ICs 12 are brought into contact with the plates 3 via the parts 4 and the ICs 12 are cooled by making a fluid having a large specific heat flow through the tubes 2. Thereby, the ICs mounted on the boards 13 can be cooled more efficiently compared to an air cooling type structure. |
| format | Patent |
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CONSTITUTION:An IC tester is constituted of a tube 11 arranged at the central part of the IC tester and a plurality of printed boards 13, which are arranged radially on the periphery of the tube 11 and are respectively mounted with ICs 12, and a test head for the IC tester use is provided with hinges 1, which are respectively fixed between the boards 13, a pair of cooling plates 3, which are held one side of them by each hinge 1 and are respectively mounted with a flow path tube 2, and heat conducting plates 5 which are respectively formed of a plurality of elastic projecting parts 4. The plates 5 are respectively inserted between a pair of the plates 3 and the ICs 12, the ICs 12 are brought into contact with the plates 3 via the parts 4 and the ICs 12 are cooled by making a fluid having a large specific heat flow through the tubes 2. Thereby, the ICs mounted on the boards 13 can be cooled more efficiently compared to an air cooling type structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSTRUMENT DETAILS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910822&DB=EPODOC&CC=JP&NR=H03192747A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910822&DB=EPODOC&CC=JP&NR=H03192747A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUZUKI SHINYA</creatorcontrib><creatorcontrib>HIROSE SEIICHI</creatorcontrib><title>STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER</title><description>PURPOSE:To make it possible to cool efficiently ICs mounted on printed boards by a method wherein hinges are respectively provided between the printed boards arranged centering around a tube, cooling plates, which are respectively mounted with a flow path tube, are held by the hinges and a fluid having a large specific heat is made to flow through the interiors of the flow path tubes. CONSTITUTION:An IC tester is constituted of a tube 11 arranged at the central part of the IC tester and a plurality of printed boards 13, which are arranged radially on the periphery of the tube 11 and are respectively mounted with ICs 12, and a test head for the IC tester use is provided with hinges 1, which are respectively fixed between the boards 13, a pair of cooling plates 3, which are held one side of them by each hinge 1 and are respectively mounted with a flow path tube 2, and heat conducting plates 5 which are respectively formed of a plurality of elastic projecting parts 4. The plates 5 are respectively inserted between a pair of the plates 3 and the ICs 12, the ICs 12 are brought into contact with the plates 3 via the parts 4 and the ICs 12 are cooled by making a fluid having a large specific heat flow through the tubes 2. Thereby, the ICs mounted on the boards 13 can be cooled more efficiently compared to an air cooling type structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSTRUMENT DETAILS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANDgkKdQ4JDXJVcPMPUnD29_fx9HNXCHENDlHwcHV0AYt6OoMFXIN4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8V4CHgbGhpZG5ibmjMTFqAL0hJZc</recordid><startdate>19910822</startdate><enddate>19910822</enddate><creator>SUZUKI SHINYA</creator><creator>HIROSE SEIICHI</creator><scope>EVB</scope></search><sort><creationdate>19910822</creationdate><title>STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER</title><author>SUZUKI SHINYA ; HIROSE SEIICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH03192747A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSTRUMENT DETAILS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SUZUKI SHINYA</creatorcontrib><creatorcontrib>HIROSE SEIICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUZUKI SHINYA</au><au>HIROSE SEIICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER</title><date>1991-08-22</date><risdate>1991</risdate><abstract>PURPOSE:To make it possible to cool efficiently ICs mounted on printed boards by a method wherein hinges are respectively provided between the printed boards arranged centering around a tube, cooling plates, which are respectively mounted with a flow path tube, are held by the hinges and a fluid having a large specific heat is made to flow through the interiors of the flow path tubes. CONSTITUTION:An IC tester is constituted of a tube 11 arranged at the central part of the IC tester and a plurality of printed boards 13, which are arranged radially on the periphery of the tube 11 and are respectively mounted with ICs 12, and a test head for the IC tester use is provided with hinges 1, which are respectively fixed between the boards 13, a pair of cooling plates 3, which are held one side of them by each hinge 1 and are respectively mounted with a flow path tube 2, and heat conducting plates 5 which are respectively formed of a plurality of elastic projecting parts 4. The plates 5 are respectively inserted between a pair of the plates 3 and the ICs 12, the ICs 12 are brought into contact with the plates 3 via the parts 4 and the ICs 12 are cooled by making a fluid having a large specific heat flow through the tubes 2. Thereby, the ICs mounted on the boards 13 can be cooled more efficiently compared to an air cooling type structure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING |
| title | STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER |
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