STRUCTURE FOR COOLING TEST HEAD FOR IC TESTER

PURPOSE:To make it possible to cool efficiently ICs mounted on printed boards by a method wherein hinges are respectively provided between the printed boards arranged centering around a tube, cooling plates, which are respectively mounted with a flow path tube, are held by the hinges and a fluid having a large specific heat is made to flow through the interiors of the flow path tubes. CONSTITUTION:An IC tester is constituted of a tube 11 arranged at the central part of the IC tester and a plurality of printed boards 13, which are arranged radially on the periphery of the tube 11 and are respectively mounted with ICs 12, and a test head for the IC tester use is provided with hinges 1, which are respectively fixed between the boards 13, a pair of cooling plates 3, which are held one side of them by each hinge 1 and are respectively mounted with a flow path tube 2, and heat conducting plates 5 which are respectively formed of a plurality of elastic projecting parts 4. The plates 5 are respectively inserted between a pair of the plates 3 and the ICs 12, the ICs 12 are brought into contact with the plates 3 via the parts 4 and the ICs 12 are cooled by making a fluid having a large specific heat flow through the tubes 2. Thereby, the ICs mounted on the boards 13 can be cooled more efficiently compared to an air cooling type structure.