SEMICONDUCTOR CHIP ASSEMBLING PROCESS INTO SUBSTRATE

PURPOSE:To increase the mounting density of semiconductor device by a method wherein semiconductor chips are arranged on the cutoff positions on the part or the whole surface of a substrate so that the bonding pad on the semiconductor chip may be wiring-connected to a wiring part or another pad on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUJIMURA HIDEYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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