SEMICONDUCTOR CHIP ASSEMBLING PROCESS INTO SUBSTRATE

PURPOSE:To increase the mounting density of semiconductor device by a method wherein semiconductor chips are arranged on the cutoff positions on the part or the whole surface of a substrate so that the bonding pad on the semiconductor chip may be wiring-connected to a wiring part or another pad on the substrate. CONSTITUTION:A substrate 1 itself is provided with tapers (gradients) or spot facings (excavations) to make the pads of semiconductor chips 2-a, 2-b or the chips 2 and a wiring pattern 4 on the substrate 1 approach to one another so that the loop level of a wire 3 need not be raised. Accordingly, the length of the wire 3 connecting to the semiconductor chip 2 can be made shorter than that of the conventional wire so as to lessen the contact between the loop of the wire 3 and the semiconductor chip 2. Through these procedures, a semiconductor in high mounting density can be manufactured.