ELECTROLESS COPPER PLATING METHOD
PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating a...
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| creator | YOSHIZAWA IZURU YAMAGUCHI NOBORU |
| description | PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating agent in an analytical reagent is made lower than that of a chelating agent in an electroless copper plating soln., copper ions are liberated from a copper complex in the reagent side and newly form a copper complex with the chelating agent in the plating soln. At the same time, the copper ions can form a complex with cyanogen ions in the plating soln. and color development is enabled in the presence of phenolphthalein. By this method, analysis is enabled without forming a precipitate at all. When the analytical reagent contg. the chelating agent is used besides the conventional analytical reagent, a precipitate is not formed at all or can rapidly be dissolved or removed even if it is formed. Since cyanogen is analyzed after the precipitate is removed, the concn. of cyanogen can stably be controlled. |
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CONSTITUTION:In the case where the stability constant of a chelating agent in an analytical reagent is made lower than that of a chelating agent in an electroless copper plating soln., copper ions are liberated from a copper complex in the reagent side and newly form a copper complex with the chelating agent in the plating soln. At the same time, the copper ions can form a complex with cyanogen ions in the plating soln. and color development is enabled in the presence of phenolphthalein. By this method, analysis is enabled without forming a precipitate at all. When the analytical reagent contg. the chelating agent is used besides the conventional analytical reagent, a precipitate is not formed at all or can rapidly be dissolved or removed even if it is formed. Since cyanogen is analyzed after the precipitate is removed, the concn. of cyanogen can stably be controlled.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910801&DB=EPODOC&CC=JP&NR=H03177577A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910801&DB=EPODOC&CC=JP&NR=H03177577A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIZAWA IZURU</creatorcontrib><creatorcontrib>YAMAGUCHI NOBORU</creatorcontrib><title>ELECTROLESS COPPER PLATING METHOD</title><description>PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating agent in an analytical reagent is made lower than that of a chelating agent in an electroless copper plating soln., copper ions are liberated from a copper complex in the reagent side and newly form a copper complex with the chelating agent in the plating soln. At the same time, the copper ions can form a complex with cyanogen ions in the plating soln. and color development is enabled in the presence of phenolphthalein. By this method, analysis is enabled without forming a precipitate at all. When the analytical reagent contg. the chelating agent is used besides the conventional analytical reagent, a precipitate is not formed at all or can rapidly be dissolved or removed even if it is formed. Since cyanogen is analyzed after the precipitate is removed, the concn. of cyanogen can stably be controlled.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09XF1Dgny93ENDlZw9g8IcA1SCPBxDPH0c1fwdQ3x8HfhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBsaG5uam5uaOxsSoAQAr4CKS</recordid><startdate>19910801</startdate><enddate>19910801</enddate><creator>YOSHIZAWA IZURU</creator><creator>YAMAGUCHI NOBORU</creator><scope>EVB</scope></search><sort><creationdate>19910801</creationdate><title>ELECTROLESS COPPER PLATING METHOD</title><author>YOSHIZAWA IZURU ; YAMAGUCHI NOBORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH03177577A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIZAWA IZURU</creatorcontrib><creatorcontrib>YAMAGUCHI NOBORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIZAWA IZURU</au><au>YAMAGUCHI NOBORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROLESS COPPER PLATING METHOD</title><date>1991-08-01</date><risdate>1991</risdate><abstract>PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating agent in an analytical reagent is made lower than that of a chelating agent in an electroless copper plating soln., copper ions are liberated from a copper complex in the reagent side and newly form a copper complex with the chelating agent in the plating soln. At the same time, the copper ions can form a complex with cyanogen ions in the plating soln. and color development is enabled in the presence of phenolphthalein. By this method, analysis is enabled without forming a precipitate at all. When the analytical reagent contg. the chelating agent is used besides the conventional analytical reagent, a precipitate is not formed at all or can rapidly be dissolved or removed even if it is formed. Since cyanogen is analyzed after the precipitate is removed, the concn. of cyanogen can stably be controlled.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | ELECTROLESS COPPER PLATING METHOD |
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