ELECTROLESS COPPER PLATING METHOD

PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YOSHIZAWA IZURU, YAMAGUCHI NOBORU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To stably control the concn. of cyanogen in an electroless copper plating soln. without precipitating copper hydroxide by using an analytical reagent contg. a divalent copper chelating agent as one of analytical reagents. CONSTITUTION:In the case where the stability constant of a chelating agent in an analytical reagent is made lower than that of a chelating agent in an electroless copper plating soln., copper ions are liberated from a copper complex in the reagent side and newly form a copper complex with the chelating agent in the plating soln. At the same time, the copper ions can form a complex with cyanogen ions in the plating soln. and color development is enabled in the presence of phenolphthalein. By this method, analysis is enabled without forming a precipitate at all. When the analytical reagent contg. the chelating agent is used besides the conventional analytical reagent, a precipitate is not formed at all or can rapidly be dissolved or removed even if it is formed. Since cyanogen is analyzed after the precipitate is removed, the concn. of cyanogen can stably be controlled.