EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

PURPOSE:To obtain an epoxy resin composition, containing at least one of lead oxide, calcium hydroxide and zinc oxide, capable of effectively suppressing corrosion of copper wires, aluminum wirings, etc., in high-temperature environment and useful for sealing semiconductors. CONSTITUTION:An epoxy re...

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Hauptverfasser:	MATSUNAGA YOSHIHIRO, SHIMAMOTO KOZO, NISHIMORI TADAO, TSUMURA KIYOAKI, MATSUOKA HIROMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an epoxy resin composition, containing at least one of lead oxide, calcium hydroxide and zinc oxide, capable of effectively suppressing corrosion of copper wires, aluminum wirings, etc., in high-temperature environment and useful for sealing semiconductors. CONSTITUTION:An epoxy resin composition, obtained by blending (A) an epoxy resin for sealing semiconductors containing an epoxy resin (e.g. cresol novolak epoxy resin), a curing agent (e.g. phenol novolak resin), a curing accelerator (e.g. triphenylphosphine), etc., with (B) at least one of lead oxide, calcium hydroxide and zinc oxide and useful for sealing semiconductors. The aforementioned composition is capable of suppressing corrosion by reacting the component (B) with organic acids produced by oxidation of the component (A) in high- temperature environment, providing nonelectrolytic organic acid salts and covering the surfaces, etc., of copper wires, etc., therewith.