FEED APPARATUS OF TAPE-AUTOMATED BONDING COMPONENT

PURPOSE:To make a delivery to a positioner sure by a method wherein, in an apparatus used to feed a tape-automated bonding component (TAB), a component-positioning pin is installed in a tray and a suction head is supported so as to be capable of being floated with reference to a feed hand. CONSTITUT...

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Bibliographische Detailangaben
Hauptverfasser:	MURAI TOSHIAKI, TANEDA KOKI, SATO KIKUO, ISHIKAWA MITSUSHIGE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To make a delivery to a positioner sure by a method wherein, in an apparatus used to feed a tape-automated bonding component (TAB), a component-positioning pin is installed in a tray and a suction head is supported so as to be capable of being floated with reference to a feed hand. CONSTITUTION:A component (TAB) 1 is sucked from a tray 10 by using a pin; after that, an up-and-down cylinder 25 is actuated by using a feed hand B; a suction chuck 55 is raised. Then, a feed robot C is actuated; and the chuck 55 which has sucked the component 1 is faced with a suction block 61 of a positioner E. At this time, the hand B stops floating and is in a locked state. Then, the cylinder 25 is lowered. A pin 58 is coupled to a hole made in a suction base 60 and is set to a floating state; it is lowered further; and a suction by means of the chuck 55 is released. After that, when a position of the component 1 is decided, the chuck 55 is lowered further; the component 1 is sandwiched by using the chuck 61; a vacuum pump is actuated; the component 1 is sucked; the chuck 55 is raised; and a delivery to a positioner E is completed.