HIGH FREQUENCY MULTILAYER BOARD

PURPOSE:To make a multilayered board thin and low in loss by a method wherein three or more dielectric layers and four or more conductor layers are formed, a resonator is provided to the inner conductor layer between the dielectric layers, either of the dielectric layers in contact with the resonator is removed to provide a cavity, and thus a microstrip structure is constituted. CONSTITUTION:In dielectric layers 17-20 and conductor layers 11-14 and 16, a high frequency circuit is divided into two parts, one is required to be low in loss and the other is not, and the dielectric layers 17 and 18 are formed as thin as possible at the part not required to be low in loss and the dielectric layers 19 and 20 is formed thick at the part required to be low in loss, either of the dielectric layers in contact with a resonator to provide a cavity, and thus a microstrip line structure is constituted. By this setup, a high frequency multilayered board which is thin and low in loss can be obtained, in which a resonator high in non-load Q required for constituting a narrow band filter can be realized.