MANUFACTURE OF THIN FILM MAGNETIC HEAD

PURPOSE:To obtain highly accurate gap depth by grinding by providing an element for gap depth confirmation at a block cutting position and measuring the gap depth of the element for confirmation when a wafer is cut into blocks. CONSTITUTION:When thin film magnetic head element 3 are formed on the wafer 16a, the element 20 for confirmation which has the same structure with the elements 3 is provided in the same array with the elements 3. When the block 17 is cut, the element 20 for confirmation is cut, and when the magnetic head element 3 which is cut in the state of the block 17a is grounded to specific necessary gap depth, the gap depth start point A of the element 20 for confirma tion is found from the sectional shape of the element 20 for confirmation which appears in the cut surface, thereby a gap-depth worked surface 19 is grounded based upon the position of the start point A of the gap depth.