MULTILAYERED CIRCUIT BOARD

MULTILAYERED CIRCUIT BOARD

PURPOSE:To prevent a multilayered circuit board from warping by a method wherein a green tape on which at least a single layer of conductor paste is formed is laminated on both sides of an insulating board solidified after burning. CONSTITUTION:A burned insulating board of alumina or the like provid...

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1. Verfasser: OTAKI SHIRO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator OTAKI SHIRO
description PURPOSE:To prevent a multilayered circuit board from warping by a method wherein a green tape on which at least a single layer of conductor paste is formed is laminated on both sides of an insulating board solidified after burning. CONSTITUTION:A burned insulating board of alumina or the like provided with a viahole filled with a conductor is prepared. At least a sheet of green tape used for insulating layers 2, 2' and 3, 3' is prepared as required, a viahole 6 is provided to each of them, and a conductor pattern 4 and conductor paste filled into the viaholes 6 are formed on the green tape. At this point, it is preferable that the material of the insulating layers 2, 2' and 3, 3' is lower than the insulating board 1 in burning temperature. Then, the green tape is made to overlap both sides of the insulating board 1 making the side of the green tape on which conductor paste is applied confronting the board 1. The green tapes overlapping the insulating board 1 are laminated on the board 1 in an integral structure by thermocompression, which is then burned nearly at the burning temperature of the material of the green tape.
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CONSTITUTION:A burned insulating board of alumina or the like provided with a viahole filled with a conductor is prepared. At least a sheet of green tape used for insulating layers 2, 2' and 3, 3' is prepared as required, a viahole 6 is provided to each of them, and a conductor pattern 4 and conductor paste filled into the viaholes 6 are formed on the green tape. At this point, it is preferable that the material of the insulating layers 2, 2' and 3, 3' is lower than the insulating board 1 in burning temperature. Then, the green tape is made to overlap both sides of the insulating board 1 making the side of the green tape on which conductor paste is applied confronting the board 1. 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CONSTITUTION:A burned insulating board of alumina or the like provided with a viahole filled with a conductor is prepared. At least a sheet of green tape used for insulating layers 2, 2' and 3, 3' is prepared as required, a viahole 6 is provided to each of them, and a conductor pattern 4 and conductor paste filled into the viaholes 6 are formed on the green tape. At this point, it is preferable that the material of the insulating layers 2, 2' and 3, 3' is lower than the insulating board 1 in burning temperature. Then, the green tape is made to overlap both sides of the insulating board 1 making the side of the green tape on which conductor paste is applied confronting the board 1. The green tapes overlapping the insulating board 1 are laminated on the board 1 in an integral structure by thermocompression, which is then burned nearly at the burning temperature of the material of the green tape.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MULTILAYERED CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T17%3A12%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OTAKI%20SHIRO&rft.date=1991-05-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH03123098A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true