MULTILAYERED CIRCUIT BOARD

PURPOSE:To prevent a multilayered circuit board from warping by a method wherein a green tape on which at least a single layer of conductor paste is formed is laminated on both sides of an insulating board solidified after burning. CONSTITUTION:A burned insulating board of alumina or the like provided with a viahole filled with a conductor is prepared. At least a sheet of green tape used for insulating layers 2, 2' and 3, 3' is prepared as required, a viahole 6 is provided to each of them, and a conductor pattern 4 and conductor paste filled into the viaholes 6 are formed on the green tape. At this point, it is preferable that the material of the insulating layers 2, 2' and 3, 3' is lower than the insulating board 1 in burning temperature. Then, the green tape is made to overlap both sides of the insulating board 1 making the side of the green tape on which conductor paste is applied confronting the board 1. The green tapes overlapping the insulating board 1 are laminated on the board 1 in an integral structure by thermocompression, which is then burned nearly at the burning temperature of the material of the green tape.