MOLDING FITTING OF MULTILAYER PRINTED BOARD
PURPOSE:To elongate a mold in service life and to protect a through-hole against conduction failure at perforation by a method wherein a cope and a drag are firmly fixed together taking advantage of a sealing material or a threaded part so as to prevent insulating adhesive agent melt by heating at t...
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| creator | MUROOKA HIDEYASU KYOI MASAYUKI |
| description | PURPOSE:To elongate a mold in service life and to protect a through-hole against conduction failure at perforation by a method wherein a cope and a drag are firmly fixed together taking advantage of a sealing material or a threaded part so as to prevent insulating adhesive agent melt by heating at the bonding operation of a multilayer printed board from flowing into a guide hole and a gas between the guide hole and a guide face. CONSTITUTION:A molding die 10 is composed of a top force 11 and a bottom force 12 so as to spatially hold a laminated body, printed wiring boards are positioned and fixed with a guide pin 13 provided with a guide face 13a which very accurately positions small positioning diameter holes 1a to each other. The positioning and the fixing of the laminated body 4 to the mold 10 is carried out by the contact of a large diameter guide hole 12b provided at a prescribed position on the bottom force 12 with a guide face 13b, and a shielding material 14 is sandwiched between a shoulder composed of the small guide face 13a and the large guide face 13b and the counterpart of the drag 12, to which a pressure is applied by a threaded part 13c of the guide pin 13. Therefore, a threaded part 11b is previously provided to the top force 11. |
| format | Patent |
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CONSTITUTION:A molding die 10 is composed of a top force 11 and a bottom force 12 so as to spatially hold a laminated body, printed wiring boards are positioned and fixed with a guide pin 13 provided with a guide face 13a which very accurately positions small positioning diameter holes 1a to each other. The positioning and the fixing of the laminated body 4 to the mold 10 is carried out by the contact of a large diameter guide hole 12b provided at a prescribed position on the bottom force 12 with a guide face 13b, and a shielding material 14 is sandwiched between a shoulder composed of the small guide face 13a and the large guide face 13b and the counterpart of the drag 12, to which a pressure is applied by a threaded part 13c of the guide pin 13. Therefore, a threaded part 11b is previously provided to the top force 11.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910121&DB=EPODOC&CC=JP&NR=H0311794A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910121&DB=EPODOC&CC=JP&NR=H0311794A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MUROOKA HIDEYASU</creatorcontrib><creatorcontrib>KYOI MASAYUKI</creatorcontrib><title>MOLDING FITTING OF MULTILAYER PRINTED BOARD</title><description>PURPOSE:To elongate a mold in service life and to protect a through-hole against conduction failure at perforation by a method wherein a cope and a drag are firmly fixed together taking advantage of a sealing material or a threaded part so as to prevent insulating adhesive agent melt by heating at the bonding operation of a multilayer printed board from flowing into a guide hole and a gas between the guide hole and a guide face. CONSTITUTION:A molding die 10 is composed of a top force 11 and a bottom force 12 so as to spatially hold a laminated body, printed wiring boards are positioned and fixed with a guide pin 13 provided with a guide face 13a which very accurately positions small positioning diameter holes 1a to each other. The positioning and the fixing of the laminated body 4 to the mold 10 is carried out by the contact of a large diameter guide hole 12b provided at a prescribed position on the bottom force 12 with a guide face 13b, and a shielding material 14 is sandwiched between a shoulder composed of the small guide face 13a and the large guide face 13b and the counterpart of the drag 12, to which a pressure is applied by a threaded part 13c of the guide pin 13. 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CONSTITUTION:A molding die 10 is composed of a top force 11 and a bottom force 12 so as to spatially hold a laminated body, printed wiring boards are positioned and fixed with a guide pin 13 provided with a guide face 13a which very accurately positions small positioning diameter holes 1a to each other. The positioning and the fixing of the laminated body 4 to the mold 10 is carried out by the contact of a large diameter guide hole 12b provided at a prescribed position on the bottom force 12 with a guide face 13b, and a shielding material 14 is sandwiched between a shoulder composed of the small guide face 13a and the large guide face 13b and the counterpart of the drag 12, to which a pressure is applied by a threaded part 13c of the guide pin 13. Therefore, a threaded part 11b is previously provided to the top force 11.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | MOLDING FITTING OF MULTILAYER PRINTED BOARD |
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