MOLDING FITTING OF MULTILAYER PRINTED BOARD

PURPOSE:To elongate a mold in service life and to protect a through-hole against conduction failure at perforation by a method wherein a cope and a drag are firmly fixed together taking advantage of a sealing material or a threaded part so as to prevent insulating adhesive agent melt by heating at the bonding operation of a multilayer printed board from flowing into a guide hole and a gas between the guide hole and a guide face. CONSTITUTION:A molding die 10 is composed of a top force 11 and a bottom force 12 so as to spatially hold a laminated body, printed wiring boards are positioned and fixed with a guide pin 13 provided with a guide face 13a which very accurately positions small positioning diameter holes 1a to each other. The positioning and the fixing of the laminated body 4 to the mold 10 is carried out by the contact of a large diameter guide hole 12b provided at a prescribed position on the bottom force 12 with a guide face 13b, and a shielding material 14 is sandwiched between a shoulder composed of the small guide face 13a and the large guide face 13b and the counterpart of the drag 12, to which a pressure is applied by a threaded part 13c of the guide pin 13. Therefore, a threaded part 11b is previously provided to the top force 11.