CERAMIC PACKAGE MODULE

PURPOSE:To execute reliably welding and sealing as well as to prevent totally and inhibit the generation of a burr, adhesion of metal powder and the like by a method wherein projected parts are provided inward along the inner peripheral edge of a weld ring on the flange surface of a metal cap and re...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HATORI YASUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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