CERAMIC PACKAGE MODULE

PURPOSE:To execute reliably welding and sealing as well as to prevent totally and inhibit the generation of a burr, adhesion of metal powder and the like by a method wherein projected parts are provided inward along the inner peripheral edge of a weld ring on the flange surface of a metal cap and re...

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Bibliographische Detailangaben
1. Verfasser: HATORI YASUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To execute reliably welding and sealing as well as to prevent totally and inhibit the generation of a burr, adhesion of metal powder and the like by a method wherein projected parts are provided inward along the inner peripheral edge of a weld ring on the flange surface of a metal cap and recessed parts are provided outward along the region on the side of the inner periphery, which comes into contact opposingly to the surface of the ring, of the ring on the flange surface. CONSTITUTION:Projected parts 4b projected inward along the inner peripheral edge of a weld ring 3 are provided on a flange surface 4a of a metal cap 4 and scribed parts 4c recessed outward over the whole periphery of the ring 3 along the region on the side of the inner periphery, which comes into contact opposingly to the surface of the ring 3, of the ring 3 are provided on the flange surface 4a of the metal cap 4. In such a way, the recessed parts 4c (gap parts), which are shapedly provided on the flange surface 4a of the cap 4 and at the region positioned on the inner peripheral edge of the ring 3, exist. Thereby, the generation of a burr or the like is eliminated on the side of the inner periphery of the ring 3 and moreover, such facts as metal powder or the like scatters or adheres on the mounting region of an electronic component 2 are also not generated.