EPOXY RESIN COMPOSITION, ITS PRODUCTION AND RESIN-SEALED SEMICONDUCTOR DEVICE

PURPOSE:To obtain an epoxy resin composition which can give a cured product of high toughness and low stress and can give a high-reliability resin-sealed semiconductor device by mixing an epoxy or phenol compound of a specified structure with another epoxy or phenol compound of a specified structure...

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1. Verfasser:	IKETANI HIROTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an epoxy resin composition which can give a cured product of high toughness and low stress and can give a high-reliability resin-sealed semiconductor device by mixing an epoxy or phenol compound of a specified structure with another epoxy or phenol compound of a specified structure. CONSTITUTION:An epoxy resin composition is prepared by mixing at least one epoxy or phenol compound (A) represented by and one of formulas I-IV with at least one other epoxy or phenol compound (B) represented by formula V or VI. The mixing ratio (by weight) is such that the amount of component B is 0.01-100 times, desirably 0.1-2 times as large as that of component A. In formulas I-VI, G1, G2 and G4 which are independent of each other are each formula VII or OH; G3 is formula VII, OH or formula VIII; G5 is formula VII (wherein R is H, a halogen atom or a hydrocarbon group, R' is H, a halogen atom, a hydrocarbon group, -SO2- or a like group; R'' is a hydrocarbon group or -SO2- and Q is a 2C or higher hydrocarbon group).