HEAT-DISSIPATING STRUCTURE OF ELECTRONIC APPARATUS

PURPOSE:To effectively cool an electronic apparatus housed in an enclosure without damaging a maintenance property by a method wherein a plurality of electronic apparatuses are attached to a heat-conducting pipe via a heat- transfer member. CONSTITUTION:A heat-conducting pipe 4 is attached to the ce...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IGARASHI YOICHI, MATSUNAGA MITSUO, SHINDO TAKANORI, ASAKAWA YOSHIFUMI, ASAI SEIJI, MORI TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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