HEAT-DISSIPATING STRUCTURE OF ELECTRONIC APPARATUS

PURPOSE:To effectively cool an electronic apparatus housed in an enclosure without damaging a maintenance property by a method wherein a plurality of electronic apparatuses are attached to a heat-conducting pipe via a heat- transfer member. CONSTITUTION:A heat-conducting pipe 4 is attached to the center of a cylindrical hermetically-sealed enclosure 1; heating-element circuit blocks 8 composed of electronic apparatuses are arranged at its circumference so as to be a radial shape; heat generated at the heating-element circuit blocks 8 is conducted to the heat-conducting pipe via conductor parts 8. The heat-conducting pipe 4 is formed as a highly heat-conducting structure, e.g. a heat pipe or a boiling and cooling structure. The heat generated at the heating-element circuit blocks 8 composed of the electronic apparatuses is connected to a radiating filn 5 whose heat resistance is low and which has been attached to the outside of the enclosure by keeping a space; it is heat-exchanged with the outside air.