FORMING METHOD FOR CABLE CONNECTION SECTION

PURPOSE:To improve the work efficiency at the time of surface treatment and improve the adhesive property between cable insulators, a mold insulator and an outside semiconductor layer by applying required surface treatment to tapered sections and cylinder sections of pencil-shaped tip sections of ca...

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Bibliographische Detailangaben
Hauptverfasser: KAZAHARU TOYOHIKO, FUJIWARA YASUTAKA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To improve the work efficiency at the time of surface treatment and improve the adhesive property between cable insulators, a mold insulator and an outside semiconductor layer by applying required surface treatment to tapered sections and cylinder sections of pencil-shaped tip sections of cable insulators to be connected by a conductor. CONSTITUTION:The end section of a cable insulator 1 to be connected by a conductor is peeled in steps to form a pencil-shaped tip section constituted of a taper section 1a and a cylinder section 1b. The surface of the taper section 1a is polished in the peripheral direction with a polishing fabric, the surface of the cylinder section 1b is roughened in the axial direction by cutting, then an insulating mold 5 and an outside semiconductor layer 8 are formed. No finish machining is applied to the cylinder section 1b, thus the work efficiency at the time of surface treatment is improved, the adhesive property between the mold 5 and the layer 8 is improved by the rough surface of the cylinder section 1b, the circular irregularity on the surface by the polishing direction of the taper section 1a serves as the barrier in the edgewise direction, and the dielectric breakdown strength of a connection section is increased.