SHEET-SHAPED ADHESIVE AND SEMICONDUCTOR DEVICE USING SAME ADHESIVE

PURPOSE:To conduct bonding to a lead frame and a package of a chip at a comparatively low temperature in a short time, and to obtain adhesives having high adhesion at a high temperature by using the mixture of a thermosetting resin and a phenoxy resin at a specific ratio. CONSTITUTION:The mixture of a 20-80 pts.wt. thermosetting resin and a 20-80 pts.wt. phenoxy resin is used as the essential ingredient of adhesives. A resin having heat resistance as high as possible must be employed as the thermosetting resin, and a polyfunctional type epoxy resin, a resol type phenol resin, a bismaleimide resin, a bismaleimide-triazine resin, a polyamino-bis-bismaleimide resin, etc., are desirable. The phenoxy resin has excellent adhesive properties to a metal, a silicon wafer, etc., because it has a large number of hydroxyl groups in a molecular chain, and the positional displacement of an element at a time when the element is bonded and fixed to a lead frame can be prevented. High adhesion is acquired even when the thermosetting resin as one component is not cured completely, thus largely shortening the thermal curing time.