ELECTRONIC PART

PURPOSE:To improve solder sucking from a land to a lead by setting the angle between the protruding part of a package main body and the lead to be 8-23 deg., and sufficiently heating the lead surface. CONSTITUTION:An electronic parts 1a is a diode constituted of a package main body 2 and three leads...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OGURI KEIJI, NOMURA MAMORU, YOSHIMURA TATSUHIKO
Format: Patent
Sprache:eng
Schlagworte:
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