ELECTRONIC PART

PURPOSE:To improve solder sucking from a land to a lead by setting the angle between the protruding part of a package main body and the lead to be 8-23 deg., and sufficiently heating the lead surface. CONSTITUTION:An electronic parts 1a is a diode constituted of a package main body 2 and three leads...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OGURI KEIJI, NOMURA MAMORU, YOSHIMURA TATSUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To improve solder sucking from a land to a lead by setting the angle between the protruding part of a package main body and the lead to be 8-23 deg., and sufficiently heating the lead surface. CONSTITUTION:An electronic parts 1a is a diode constituted of a package main body 2 and three leads 3 protruding from the side surfaces of the main body. The angle between the protruding surface of the main body 2, from which surface the leads 3 protrude, and the leads, i.e., the lead angle theta is set to be 8-23 deg.. When the electronic parts 1a is subjected to re-flow soldering on a mounting board, the inclination angle of the outer lead 3b with respect to the mounting surface of the board becomes adequate. Thereby the solder spread on the land of the mounting board is easily sucked up from the land to the lead part 3b.