EXPOSURE DEVICE

PURPOSE:To make the title exposure device optimum for manufacturing semiconductor devices by a method wherein the light flux from a lighting source of a lighting system is divided into two light fluxes of exposure light and non- exposure light by a light dividing means to lead them onto a mask surface and a wafer surface. CONSTITUTION:A pattern on a mask 8 surface is irradiated with an exposure light reflected by a cold mirror 3 our of light flux from a light source after unifying the light flux by a fly eye lens 5 through a shutter 4 further through a mirror 6. Then, the exposure light is projected on a water 10 surface at specified magnification. On the other hand, the heat ray of non-exposure light passing through another mirror 3 is cut off by a heat ray filter 21 to be led to the right and left side observation system by a light guide 23. Condenser lenses 24a, 24b converges light flux from the light guide 23 to irradiate the mask 8 surface using respective elements on the optical path reaching objective lenses 28a, 28b for lighting the alignment mark on the water 10 surface. In such a constitution, the title exposure device can be miniaturized and simplified by using only one light source 1.