EPOXY RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE

PURPOSE:To obtain the title compsn. with excellent heat resistance and low stress characteristics by incorporating each specified epoxy resin and curing agent. CONSTITUTION:One or more epoxy resins of formulas I-V (wherein B is a group of formula VI; B' is a group of formula VII; Q is a 1C or h...

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Bibliographische Detailangaben
1. Verfasser:	IKETANI HIROTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the title compsn. with excellent heat resistance and low stress characteristics by incorporating each specified epoxy resin and curing agent. CONSTITUTION:One or more epoxy resins of formulas I-V (wherein B is a group of formula VI; B' is a group of formula VII; Q is a 1C or higher hydrocarbon group: R is H, Q or a halogenated hydrocarbon group; X is R or a halogen; m is 0 or 1 or larger, n is 1 or larger) and one or more curing agents having a phenolic hydroxyl group of formulas VIII-XIII (wherein A is a group of formula XIV; A' is a group of formula XV) are incorporated as essential components. However, combinations of formulas I and VIII (wherein m=0), formulas I and XII and formulas IV and XII are excluded.