RADIAL FLOW HEAT SINK AND SEMICONDUCTOR COOLER USING THE SAME

PURPOSE:To individually feed cooling fluids, to easily feed out, and to obtain a heat sink structure having high heat sink performance by providing an axial through hole at the center of laminated fins, introducing the fluid into the hole, and radially feeding along the laminated fins. CONSTITUTION:...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OGURO TAKAHIRO, ASHIWAKE NORIYUKI, ZUSHI SHIZUO, KOBAYASHI AKIMINE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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