RADIAL FLOW HEAT SINK AND SEMICONDUCTOR COOLER USING THE SAME

PURPOSE:To individually feed cooling fluids, to easily feed out, and to obtain a heat sink structure having high heat sink performance by providing an axial through hole at the center of laminated fins, introducing the fluid into the hole, and radially feeding along the laminated fins. CONSTITUTION:Platelike fins 2 having a through hole 1 are radially disposed to be laminated through a space member 3 to compose a heat sink of a semiconductor cooler. Cooling fluid 4 introduced into the axial passage 5 of the cooler is radially converted by a bottom plate 8 to flow radially in a small gap 7 formed of many platelike fins. A heat generating element composed of the heat sink is attached through a bottom plate 8, heat is transferred sequentially to the fins by the member 3 applied to the fins, and transferred from the fins to cooling fluid 6 flowing radially in the narrow gap 7. The gap 7 between the fins is so held that the heat dissipation efficiency of the heat sink becomes maximum by the member 3.