RADIAL FLOW HEAT SINK AND SEMICONDUCTOR COOLER USING THE SAME
PURPOSE:To individually feed cooling fluids, to easily feed out, and to obtain a heat sink structure having high heat sink performance by providing an axial through hole at the center of laminated fins, introducing the fluid into the hole, and radially feeding along the laminated fins. CONSTITUTION:...
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| creator | OGURO TAKAHIRO ASHIWAKE NORIYUKI ZUSHI SHIZUO KOBAYASHI AKIMINE |
| description | PURPOSE:To individually feed cooling fluids, to easily feed out, and to obtain a heat sink structure having high heat sink performance by providing an axial through hole at the center of laminated fins, introducing the fluid into the hole, and radially feeding along the laminated fins. CONSTITUTION:Platelike fins 2 having a through hole 1 are radially disposed to be laminated through a space member 3 to compose a heat sink of a semiconductor cooler. Cooling fluid 4 introduced into the axial passage 5 of the cooler is radially converted by a bottom plate 8 to flow radially in a small gap 7 formed of many platelike fins. A heat generating element composed of the heat sink is attached through a bottom plate 8, heat is transferred sequentially to the fins by the member 3 applied to the fins, and transferred from the fins to cooling fluid 6 flowing radially in the narrow gap 7. The gap 7 between the fins is so held that the heat dissipation efficiency of the heat sink becomes maximum by the member 3. |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | RADIAL FLOW HEAT SINK AND SEMICONDUCTOR COOLER USING THE SAME |
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